
DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is DDR2-800 CL5 Unbuffered Memory module. The Module density from 512MB to 2GB, it consists 64/128MX8 bit DDR2 800 Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 240-pin edge connector sockets. The electrical and mechanical specifications are as follows
| JEDEC Standard | |
| DDR2 Speed Grade : 800Mbps | |
| Unbuffered DIMM : 240-pin | |
| Memory Organization : x8 FBGA DRAM chip | |
| DDR2 DRAM interface : SSTL_18 | |
| CAS latency : 5-5-5 |
|
| Bandwidth : 6400MB/s |
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| VDD voltage : 1.8+-0.1V | |
| VDDQ voltage : 1.8+-0.1V |
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| Serial presence detect with EEPROM | |
| PCB height : 1.18 inch | |
| RoHS Compliant |
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| Application : Desktop |

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