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Adopts high-quality 3D NAND wafer level chip
Supports PCIe3.0 x4, and NVMe 1.3 protocol
All-metal cooling plate is included; equipped with intelligent temperature control technology
Supports TRIM to improve read/write performance and speed
Supports Max. Write technology for full-disk SLC cache
Supports LDPC ECC
Low power consumption management
2,999
Adopts high-quality 3D NAND wafer level chip
Supports PCIe3.0 x4, and NVMe 1.3 protocol
All-metal cooling plate is included; equipped with intelligent temperature control technology
Supports TRIM to improve read/write performance and speed
Supports Max. Write technology for full-disk SLC cache
Supports LDPC ECC
Low power consumption management
5,999