
DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is DDR2-533 CL4 Small Outline Memory module. The Module density from 256MB to 2GB, it consists DDR2-533MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 200-pin edge connector sockets.
| JEDEC Standard | |
| DDR2 Speed Grade : 533Mbps | |
| SO-DIMM : 200-pin | |
| Memory Organization : x8 , x16 FBGA DRAM chip | |
| DDR2 DRAM interface : SSTL_18 | |
| CAS latency : 4-4-4 | |
| Bandwidth : 4300MB/s | |
| VDD voltage : 1.8+-0.1V | |
| VDDQ voltage : 1.8+-0.1V | |
| Serial presence detect with EEPROM | |
| PCB height : 1.181 inch | |
| RoHS Compliant | |
| Application : NoteBook |

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