- Essentials | ||
Status | Launched | |
Launch Date | Q2'14 | |
Processor Number | G3240 | |
# of Cores | 2 | |
# of Threads | 2 | |
Clock Speed | 3.1 GHz | |
Intel® Smart Cache | 3 MB | |
DMI2 | 5 GT/s | |
# of QPI Links | 0 | |
Instruction Set | 64-bit | |
Instruction Set Extensions | SSE4.1/4.2 | |
Embedded Options Available | No | |
Lithography | 22 nm | |
Scalability | 1S Only | |
Max TDP | 53 W | |
Thermal Solution Specification | PCG 2013C | |
Conflict Free | Yes | |
Datasheet | Link |
- Memory Specifications | ||
Max Memory Size (dependent on memory type) | 32 GB | |
Memory Types | DDR3-1333 | |
# of Memory Channels | 2 | |
Max Memory Bandwidth | 21.3 GB/s | |
ECC Memory Supported | Yes |
- Graphics Specifications | ||
Processor Graphics | Intel® HD Graphics | |
Graphics Base Frequency | 350 MHz | |
Graphics Max Dynamic Frequency | 1.1 GHz | |
Graphics Video Max Memory | 1.7 GB | |
Intel® Quick Sync Video | Yes | |
Intel® Wireless Display | Yes | |
Intel® Clear Video HD Technology | Yes | |
# of Displays Supported | 3 |
- Expansion Options | ||
PCI Express Revision | 3.0 | |
PCI Express Configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Max # of PCI Express Lanes | 16 |
- Package Specifications | ||
Max CPU Configuration | 1 | |
TCASE | 72°C | |
Package Size | 37.5mm x 37.5mm | |
Graphics and IMC Lithography | 22nm | |
Sockets Supported | FCLGA1150 | |
Low Halogen Options Available | See MDDS |
- Advanced Technologies | ||
Intel® Turbo Boost Technology | No | |
Intel® vPro Technology | No | |
Intel® Hyper-Threading Technology | No | |
Intel® Virtualization Technology (VT-x) | Yes | |
Intel® Virtualization Technology for Directed I/O (VT-d) | No | |
Intel® VT-x with Extended Page Tables (EPT) | Yes | |
Intel® TSX-NI | No | |
Intel® 64 | Yes | |
Idle States | Yes | |
Enhanced Intel SpeedStep® Technology | Yes | |
Thermal Monitoring Technologies | Yes | |
Intel® Stable Image Platform Program (SIPP) | No |
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