
- Essentials | ||
| Status | Launched | |
| Launch Date | Q3'13 | |
| Processor Number | G3220 | |
| # of Cores | 2 | |
| # of Threads | 2 | |
| Clock Speed | 3 GHz | |
| Intel® Smart Cache | 3 MB | |
| DMI2 | 5 GT/s | |
| # of QPI Links | 0 | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE4.1/4.2 | |
| Embedded Options Available | No | |
| Lithography | 22 nm | |
| Max TDP | 53 W | |
| Thermal Solution Specification | PCG 2013C | |
| Recommended Customer Price | ||
- Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21.3 GB/s | |
| ECC Memory Supported | Yes | |
- Graphics Specifications | ||
| Processor Graphics | Intel® HD Graphics | |
| Graphics Base Frequency | 350 MHz | |
| Graphics Max Dynamic Frequency | 1.1 GHz | |
| Intel® Quick Sync Video | Yes | |
| Intel® Clear Video HD Technology | No | |
| # of Displays Supported | 3 | |
- Expansion Options | ||
| PCI Express Revision | 3.0 | |
| PCI Express Configurations | Up to 1x16, 2x8, 1x8/2x4 | |
| Max # of PCI Express Lanes | 16 | |
- Package Specifications | ||
| Max CPU Configuration | 1 | |
| TCASE | 72°C | |
| Package Size | 37.5mm x 37.5mm | |
| Graphics and IMC Lithography | 22nm | |
| Sockets Supported | FCLGA1150 | |
| Low Halogen Options Available | See MDDS | |
- Advanced Technologies | ||
| Intel® Turbo Boost Technology | No | |
| Intel® vPro Technology | No | |
| Intel® Hyper-Threading Technology | No | |
| Intel® Virtualization Technology (VT-x) | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No | |
| Intel® VT-x with Extended Page Tables (EPT) | Yes | |
| Intel® TSX-NI | No | |
| Intel® 64 | Yes | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Thermal Monitoring Technologies | Yes | |
| Intel® Stable Image Platform Program (SIPP) | No | |

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