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- Essentials | ||
| Processor Number | G3250 | |
| Lithography | 22 nm | |
- Performance | ||
| # of Cores | 2 | |
| # of Threads | 2 | |
| Processor Base Frequency | 3.20 GHz | |
| Cache | 3 MB SmartCache | |
| Bus Speed | 5 GT/s DMI2 | |
| TDP | 53 W | |
- Supplemental Information | ||
Embedded Options Available | No | |
| Conflict Free | Yes | |
| Datasheet | Link | |
- Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 32 GB | |
| Memory Types | DDR3-1333, DDR3L-1333 @ 1.5V | |
| Max # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21.3 GB/s | |
| ECC Memory Supported | Yes | |
- Graphics Specifications | ||
| Processor Graphics | Intel® HD Graphics | |
| Graphics Base Frequency | 350.00 MHz | |
| Graphics Max Dynamic Frequency | 1.10 GHz | |
| Graphics Video Max Memory | 1.7 GB | |
| Graphics Output | eDP/DP/HDMI/DVI/VGA | |
| Max Resolution (HDMI 1.4) | 1920x1080@60Hz | |
| Max Resolution (DP) | 2560x1600@60Hz | |
| Max Resolution (eDP - Integrated Flat Panel) | 2560x1600@60Hz | |
| Max Resolution (VGA) | 1920x1200@60Hz | |
| DirectX* Support | 11.1/12 | |
| OpenGL* Support | 4.3 | |
| Intel® Quick Sync Video | Yes | |
| # of Displays Supported | 3 | |
- Expansion Options | ||
| Scalability | 1S Only | |
| PCI Express Revision | Up to 3.0 | |
| PCI Express Configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Max # of PCI Express Lanes | 16 | |
- Package Specifications | ||
| Sockets Supported | FCLGA1150 | |
| Max CPU Configuration | 1 | |
| Thermal Solution Specification | PCG 2013C | |
| TCASE | 72°C | |
| Package Size | 37.5mm x 37.5mm | |
| Low Halogen Options Available | See MDDS | |
- Advanced Technologies | ||
| Intel® Turbo Boost Technology | No | |
| Intel® vPro Technology | No | |
| Intel® Hyper-Threading Technology | No | |
| Intel® Virtualization Technology (VT-x) | Yes | |
| Intel® Virtualization Technology for Directed I/O (VT-d) | No | |
| Intel® VT-x with Extended Page Tables (EPT) | Yes | |
| Intel® TSX-NI | No | |
| Intel® 64 | Yes | |
| Instruction Set | 64-bit | |
| Instruction Set Extensions | SSE4.1/4.2 | |
| Idle States | Yes | |
| Enhanced Intel SpeedStep® Technology | Yes | |
| Thermal Monitoring Technologies | Yes | |
| Intel® Stable Image Platform Program (SIPP) | No | |
- Intel® Data Protection Technology | ||
| Intel® AES New Instructions | No | |
| Secure Key | Yes | |
- Intel® Platform Protection Technology | ||
| Trusted Execution Technology | No | |
| Execute Disable Bit | Yes | |
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