DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.
The Module is DDR2-800 CL5 Small Outline Memory module. The Module
density from 256MB to 2GB, it consists DDR2-800MHz Synchronous DRAMs in
FBGA packages, Memory Module intented for mounting into 200-pin edge
connector sockets.
JEDEC Standard | |
DDR2 Speed Grade : 800Mbps | |
SO-DIMM : 200-pin | |
Memory Organization : x8 , x16 FBGA DRAM chip | |
DDR2 DRAM interface : SSTL_18 | |
CAS latency : 5-5-5 | |
Bandwidth : 6400MB/s | |
VDD voltage : 1.8+-0.1V | |
VDDQ voltage : 1.8+-0.1V | |
Serial presence detect with EEPROM | |
PCB height : 1.181 inch | |
RoHS Compliant | |
Application : NoteBook |
Located in the Philippines!
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